The heat-dissipating water-cooling plate for electronic components in the prior art is a relatively common heat-dissipating water-cooling plate for electronic components currently used on railway locomotives. That is, the cooling liquid circulates inside the water-cooling plate through the water inlet and outlet of the water-cooling plate, and the surface of the water-cooling plate can dissipate the heat of electronic components. Through the heat exchange reaction between the two, the electronic components are dissipated so as to keep them in normal working condition and prolong the service life of the electronic components.
Because the main material used for the water-cooled plate is aluminum plate with higher purity. Pure aluminum is a relatively active metal, so this type of water-cooled plate will be oxidized after welding or in the normal atmospheric environment, and a layer of aluminum oxide (Al2O3) film will naturally form on the surface. However, the performance of the aluminum oxide (Al2O3) film is unstable, susceptible to acid corrosion, and its thermal conductivity is poor, which affects the overall heat dissipation performance of the water-cooled plate.
Technical realization elements:
In order to solve the problems of the prior art, the present invention provides a heat dissipation water cooling plate and a manufacturing method thereof. A layer of aluminum nitride film is formed on the surface of the water-cooled plate to improve the corrosion resistance and oxidation resistance of the water-cooled plate, and at the same time increase the heat dissipation rate of the water-cooled plate. The technical solution is as follows:
The present invention provides a heat-dissipating water-cooling plate, which includes a laminated base plate, a brazing plate, a fin and a mounting plate. Wherein, the base plate is provided with a flow groove, and the mounting plate is provided with a first mounting hole matched with the water inlet connector and a second mounting hole matched with the water outlet connector. Both the water inlet connector and the water outlet connector are connected with the flow tank. The outer side of the mounting board is covered with a layer of reinforced film, and the reinforced film is aluminum nitride film.
The brazing plate includes a first brazing plate and a second brazing plate, and the fin is sandwiched between the first brazing plate and the second brazing plate.
The number of fins is multiple, and multiple fins are arranged side by side.
The number of the first brazing plates is the same as the number of the fins, and the first brazing plates and the fins are in one-to-one correspondence.
A number of partitions are arranged on the base plate, and the partitions divide the base plate into a plurality of slot division units, and the slot division units correspond to the first brazing plate in a one-to-one correspondence.
The outer surface of the substrate is covered with a layer of reinforced film, and the reinforced film is an aluminum nitride film.
The present invention provides a method for manufacturing a heat-dissipating water-cooling plate, which includes the following steps:
S11. Assemble the base plate, brazing plate, fin and mounting plate into a water-cooled plate;
S12: Send the assembled water-cooled plate into the reaction furnace, so that a layer of aluminum nitride film is formed on the outer surface of the water-cooled plate.
The base plate and the mounting plate are made of aluminum, and the reaction furnace includes a furnace body, a nitrogen gas supply module, a carbon supply module, and a heating module, or the reaction furnace further includes a catalyst module.
The present invention provides a method for manufacturing a heat-dissipating water-cooling plate, which includes the following steps:
S21, sending the substrate and the mounting board into the reaction furnace, so that a layer of aluminum nitride film is formed on the surface of the substrate and the mounting board;
S22: Assemble brazing plates and fins between the substrate with the aluminum nitride film formed on the surface and the mounting plate to obtain a water-cooled plate.
Further, the base plate and the mounting plate are made of aluminum, and the reaction furnace includes a furnace body, a nitrogen gas supply module, a carbon supply module, and a heating module, or the reaction furnace further includes a catalyst module.
The beneficial effects brought about by the technical solution provided by the present invention are as follows:
1) The thermal conductivity of aluminum nitride is 260W/(m.K), which is 6-8 times higher than that of alumina, which improves the heat dissipation effect of the water-cooled plate;
2) Aluminum nitride belongs to the covalent bond compound of structural units, has a wurtzite structure, and belongs to the hexagonal crystal system. Therefore, it has better corrosion resistance than alumina, and is more conducive to the use of the product in a relatively harsh air environment with a higher pH;
3) Strong anti-oxidation ability and prolong service life.
