The static reactive power compensation device (SVC) device is an important device for comprehensively controlling voltage fluctuations and flicker, harmonics and voltage imbalance. SVG is a new type of static reactive power compensation device that is more advanced than SVC. It is an important part of flexible and flexible AC transmission system (FACTS) technology and customized power (CP) technology, and the development direction of modern reactive power compensation devices. Both have been widely used in power transmission and distribution power systems:
Long-distance power transmission, urban secondary substation (35/110kV), electric arc furnace, rolling mill hoist and other heavy industrial loads, regional power grid, photovoltaic power supply, wind farm, electric locomotive power supply and other fields. SVG is a high-heat component, and it needs to be matched with a radiator with excellent heat dissipation performance to ensure other stable operation and increase the service life.
KangDing Thermal Energy has rich technical experience in SVC/SVG heat dissipation. Our company can provide solutions with excellent heat sink performance, including technical service support for natural cooling, forced air cooling, and liquid cooling.
The customer’s SVG heat dissipation design requirements are as follows
| Ambient temperature: | 40℃ | Style model: | R4D560-AQ03-01 |
| Altitude: | 3000m | Overall temperature requirements: | <35℃ |
| Assumed IGBT model: |
Infineon IHV IGBT, 1250W/pcs, a total of 2pcs, resistor body 100W, total 2600W。 |
Cooling medium model: |
I0.2mm K=4W/m*K |
| Module power and quantity: | 7, total power is 2600*7=18200W |
IGBT model simulation diagram and parameters
• The size of the radiator is 400x380x100mm, and the heat pipe layout is specially designed;
• Use thermal grease between the heating element and the heat sink;
• Use customized heat pipe with wall thickness of 1.0MM to ensure heat dissipation efficiency;
• There are 8 9.5 mm heat pipes at the bottom, and the round pipe is inserted into the groove and flattened to ensure the heat dissipation efficiency;
• Thermal analysis Epoxy thermal conductivity is adjusted to the corresponding data of the working limit temperature to ensure the consistency between the simulation and the actual;
• Adopt all-aluminum Bonded heat sink;
• The unit weight of the product is approximately: 22.6Kg;
• Use AL5052 for the FIN film at the bottom of the board, thermal conductivity: 138 w/m^2 K;
The parameters of the radiator fan are
Ebm-papst 560 fan, model: R4D560-AQ03
Plane schematic diagram of radiator form
Adopt bonded fin +8 heat pipe design
Schematic diagram of the air inlet and outlet simulation of the radiator
Schematic diagram of wind flow simulation
Schematic diagram of radiator temperature simulation
IGBT arrangement diagram, the inlet wind speed is the middle point of the fin-shaped outer distance of the heat sink 2~3cm
Schematic diagram of radiator temperature measurement point simulation
| Item | Maximum temperature ℃ | Inlet wind speed m/s | Thermal resistance C/W | The simulation data of the radiator shows that the temperature is below 75℃, and the temperature rise is less than 35℃, which meets the requirements set by the customer. |
| Module 1 | 74.56 | 5.4 | 0.0133 | |
| Module 2 | 5.39 | 0.013 | ||
| Module 3 | 74.52 | 5.4 | 0.013 | |
| Module 4 | 74.72 | 5.36 | 0.013 | |
| Module 5 | 74.56 | 5.56 | 0.013 | |
| Module 6 | 74.63 | 5.58 | 0.013 | |
| Module 7 | 74.43 | 5.58 | 0.013 |
