Foam metal heat dissipation
Foam metal can be divided into open cell and closed cell according to its cell structure. The pores in the closed-cell foam metal are separated by the metal framework, independent of each other and not connected to each other, that is, each pore is closed; The holes in the open-cell foam metal are connected to each other, and fluid can seep through the holes. In the open-cell foam metal, due to the existence of holes, the heat exchange area of the fluid and the metal skeleton is increased, and it can be prepared as a heat exchange medium and applied to compact radiators of various equipment. At the same time, due to its high strength, high toughness and light weight, it can be used as a buffer and shock absorber for automobile structural parts, aerospace equipment, etc., and can also be applied to the landing gear of the space shuttle.
Foamed metal can quickly dissipate the heat passing through its channel due to its large specific surface area and large thermal conductivity of the metal frame, so it may be called the core material for preparing new heat sinks. Solve the increasingly serious heat dissipation problem of electronic products and promote the rapid development of electronic products.
Soaking plate heat dissipation
The soaking plate is a vacuum two-phase fluid device with a capillary structure inside, and a special working liquid is injected into the cavity. When the soaking plate is working, the phase change process from liquid phase to gas phase or gas phase to liquid phase occurs when the internal working fluid is heated or cooled, and absorbs or releases a large amount of heat for rapid heat transfer. The vacuum inside the soaking plate has a working medium, and the inner wall has a wick structure. When the heat equalizing plate is heated, the working liquid on the evaporation surface evaporates into steam, and the steam condenses into liquid on the condensation surface. The liquid returns to the evaporation surface through the wick structure under capillary action, forming a circulation.
As a new type of high-efficiency heat dissipation technology, the soaking plate has the advantages of high thermal conductivity and good temperature uniformity, and is increasingly used in airborne electronic equipment. The paper introduces the heat dissipation principle of the soaking plate, and conducts an experimental study on the heat dissipation performance of the soaking plate and the same size electronic device module shell under different working conditions. The temperature equalization effect and heat dissipation effect of the two were compared and tested. The test results show that the uniform temperature effect of the soaking plate is better than that of the conventional aluminum module shell of the same size; The greater the power consumption and heat flow density, the more obvious the heat dissipation advantage of the soaking plate; Using different heat dissipation methods, the temperature difference between the chip in the soaking plate and the chip in the module housing is the same; With multiple chips, the higher the total power consumption, the higher the chip surface temperature, the more concentrated the chip heat flux, and the higher the chip surface temperature. When the heat dissipation limit is reached, it should be designed as a multi-chip, low heat flux form, and the soaking plate can achieve a better heat dissipation effect.
