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Heat sink manufacturing supplier
National hotline:+86 13827205356
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Aluminum Heat Sink & Profile Manufacturing

address:No. 51 Luming Road Heavy River Management District - Qing Town Dongguan City

Q Q:2131405854

Telephone:+86 13827205356

mailbox:cnc@cncstamping.com

Design and manufacture of computer heat sink

Computer heat sinks include: CPU heat sinks, VGA heat sinks, chassis heat sinks, graphics card heat sinks, motherboard chipset heat sinks, hard disk heat sinks, power heat sinks, chassis, optical drives and memory all need heat sinks.

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Selection of computer heat sink material
Computer heat sinks include: CPU heat sinks, VGA heat sinks, chassis heat sinks, graphics card heat sinks, motherboard chipset heat sinks, hard disk heat sinks, power heat sinks, chassis, optical drives and memory all need heat sinks.

The computer's CPU and other components generate heat during high-speed operation. Heat dissipation is actually a process of heat transfer. The purpose is to bring the heat generated by the CPU to other media and control the CPU temperature within a stable range. According to the environment in which we live, the heat of the CPU will eventually be dissipated into the air. This process is the heat dissipation of the computer.


hard disk heat sinks
Classification of heat dissipation
CPU cooling is actually a process of heat transfer. The purpose is to bring the heat generated by the CPU to other media and control the CPU temperature within a stable range. According to the environment in which we live, the heat of the CPU will eventually be dissipated into the air. The heat transfer process between these is the role that the heat sink will play.

All heat sinks use heat conduction and heat convection as the main way to dissipate heat. At present, there is no product that can cool the chip with heat radiation as the main method. According to the different means of heat conduction and heat convection, heat sink products can be divided into active heat dissipation and passive heat dissipation. The meaning of active heat dissipation is that energy that has nothing to do with the heating element participates in forced heat dissipation, such as fans, water pumps in liquid cooling, and compressors in phase change refrigeration. The general feature of active heat dissipation is high efficiency, but it also requires the assistance of other energy sources. On the contrary, the meaning of passive heat dissipation is easy to understand, that is, only relying on the self-emission of the heating element or heat sink to cool down.

Design computer heat sink
Computer heat sink material selection
In the selection of heat sink materials, the following three aspects are mainly considered:
1. Good thermal conductivity—— Thermal conductivity is a more general term, including concepts such as thermal conductivity and specific heat. Compared with other solid materials, the thermal conductivity of metal determines that it is more suitable for heat sink manufacturing; The heat quickly, such as copper, aluminum, and rapid cooling, which all have their own characteristics of the metal determined.

2. Easy to process —— good ductility, relatively stable at high temperature, various processing techniques can be used;
3. Easy to obtain —— Although metals are also non-renewable resources, they are supplied in large quantities, do not require special processes, and are relatively inexpensive;
Based on the above three points, the type of material used for the heat sink is determined. These issues have already been explained when introducing the thermal conductivity and specific heat value above. However, when selecting materials, in addition to comprehensive consideration of the level of thermal conductivity, it is also necessary to take into account the mechanical properties and price of the material.

Based on the above three points, the type of material used for the heat sink is determined. These issues have already been explained when introducing the thermal conductivity and specific heat value above. However, when selecting materials, in addition to comprehensive consideration of the level of thermal conductivity, it is also necessary to take into account the machining performance and price of the material.
Heat sink for electronic power supply