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Several electronic and mechanical cooling methods

time:2021-01-09 11:05 author:Heat sink design click:

Air cooling technology
Active heat dissipation, subdivided in terms of heat dissipation, can be divided into air cooling, liquid cooling, heat pipe cooling, semiconductor cooling, chemical cooling, and so on.

Wind cooling
Air cooling is the most common way of heat dissipation, and in comparison, it is also a cheaper way. Air cooling is essentially the use of a fan to take away the heat absorbed by the radiator. It has the advantages of relatively low price and convenient installation. However, it is highly dependent on the environment. For example, the heat dissipation performance will be greatly affected when the temperature increases and overclocking.

Liquid cooling
Liquid cooling heat dissipation is the forced circulation of liquid driven by a pump to take away the heat from the radiator. Compared with air cooling, it has the advantages of quietness, stable cooling, and less dependence on the environment. The price of liquid cooling is relatively high, and installation is relatively troublesome. At the same time, try to install in accordance with the instructions in the manual to get the best heat dissipation effect.
For cost and ease of use considerations, liquid-cooled heat dissipation usually uses water as the heat transfer liquid, so liquid-cooled radiators are often called water-cooled radiators.

Heat pipe cooling technology
Heat pipe
The heat pipe is a kind of heat transfer element. It makes full use of the heat conduction principle and the fast heat transfer properties of the refrigerant, and transfers heat through the evaporation and condensation of the liquid in the fully enclosed vacuum tube. It has a series of advantages such as extremely high thermal conductivity, good isothermal property, the heat transfer area on both sides of the cold and heat can be changed arbitrarily, the heat can be transferred over a long distance, and the temperature can be controlled. In addition, the heat exchanger composed of heat pipes has the advantages of high heat transfer efficiency, compact structure, and low fluid resistance. Its thermal conductivity has far exceeded that of any known metal.

Heat dissipation technology of vacuum chamber soaking plate
The vacuum chamber soaking plate technology is similar to the heat pipe in principle, but is different in the conduction mode. The heat pipe is one-dimensional linear heat conduction, while the heat in the vacuum chamber soaking plate is conducted on a two-dimensional surface, so the efficiency is higher. Specifically, after the liquid at the bottom of the vacuum cavity absorbs the heat of the chip, it evaporates and diffuses into the vacuum cavity, conducts the heat to the heat dissipation fins, and then condenses into liquid and returns to the bottom. This kind of evaporation and condensation process similar to refrigerator air conditioner circulates quickly in the vacuum chamber, achieving a fairly high heat dissipation efficiency. Vapor-X vacuum chamber soaking plate is a product that can be seen in the market, and there are two types based on GPU and CPU.

Semiconductor cooling technology
Bi-piezo cooling jet
The United States General Electric Company recently announced a breakthrough heat dissipation technology, which is comparable in size to a credit card and can be used in the next generation of ultra-thin tablets and notebooks. This kind of radiator is called DCJ (Dual Piezoelectric Cooling Jets), which can be understood as a micro-flow air box that sprays high-speed air to electronic equipment. The turbulent air emitted by the DCJ increases the heat exchange rate by 10 times compared to the conventional convective air. Compared with the existing cooling equipment, the thickness of the DCJ radiator is only 4mm, which is reduced by 50%, and the power consumption is only half of the fan radiator. In addition, its simple structure has higher reliability and maintainability than traditional radiators.

Sandia radiator (air bearing heat exchanger)
This kind of "Sandia Cooler" is also called "Air Bearing Heat Exchanger". The biggest feature is to make the stationary heat sink spin at a high speed. The biggest heat exchange bottleneck in the traditional CPU heat sink is the dead air boundary layer attached to the heat sink. In the Sandia radiator, heat is efficiently transferred from the stationary base to the rotating fin structure through a narrow gap of only 0.001 inches (25 microns) thick. The static boundary layer of air enveloping the heat sink has a powerful centrifugal pump effect, making the boundary thickness only one-tenth of that under normal conditions, thereby significantly improving heat dissipation efficiency in a smaller space. The high-speed rotating heat exchange heat sink basically does not have the problem of "hiding dirt and holding dirt", and will not accumulate a pile of difficult-to-remove dust over time like traditional heat sinks. In addition, the way the heat sink cuts the air has also been redesigned, which greatly improves aerodynamic efficiency with extremely low noise.

Liquid cooling technology
Semiconductor refrigeration
Semiconductor refrigeration is to use a special type of semiconductor refrigeration sheet to produce a temperature difference when energized to cool. As long as the heat of the high temperature end can be effectively dissipated, the low temperature end will be continuously cooled. A temperature difference is generated on each semiconductor particle, and a refrigeration sheet is formed by connecting dozens of such particles in series, thereby forming a temperature difference on the two surfaces of the refrigeration sheet. Using this temperature difference phenomenon, combined with air cooling/water cooling to cool the high-temperature end, an excellent heat dissipation effect can be obtained.
Semiconductor refrigeration has the advantages of low cooling temperature and high reliability. The temperature of the cold surface can reach below minus 10°C, but the cost is too high, and the CPU condensation may cause a short circuit due to the low temperature, and the technology of the semiconductor refrigeration chip is not mature and not practical enough.

Chemical refrigeration
The so-called chemical refrigeration is to use some ultra-low temperature chemical substances, using them to absorb a lot of heat when they melt to reduce the temperature. In this regard, the use of dry ice and liquid nitrogen is more common. For example, using dry ice can reduce the temperature to below minus 20°C, and some more "abnormal" players use liquid nitrogen to lower the CPU temperature to below minus 100°C (in theory). Of course, due to the high price and the short duration, this method is more common in laboratories or extreme overclocking enthusiasts.

Improve the heat conduction capacity of the heat sink. No matter which heat dissipation method is adopted, the problem of how to efficiently transfer heat from the heat source such as the CPU to the heat dissipation body must be solved first. For air-cooled heat dissipation, it needs to transfer the heat generated by the CPU to the heat sink by heat conduction, and then the fan rotates at a high speed to take most of the heat away by convection (including forced convection and natural convection); The same is true for liquid cooling. In this process, the heat directly dissipated by the radiation method is very small, and the decisive role is the first step to improve the efficiency of heat conduction and take the heat away from the heat source.

To improve the efficiency of heat conduction, according to the formula of "Q=K×A×ΔT/ΔL", the thermal conductivity is directly proportional to the thermal conductivity of the heat sink, the contact area and the temperature difference. It is inversely proportional to the bonding distance. We will discuss this one by one below.