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Aluminum Heat Sink & Profile Manufacturing

address:No. 51 Luming Road Heavy River Management District - Qing Town Dongguan City

Q Q:2131405854

Telephone:+86 13827205356

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Characteristics of thermal silica gel and ceramic heat sink

time:2021-01-20 10:38 author:Heat sink design click:

Thermal conductive silicone sheet
What are the differences between thermal silica gel and ceramic heat sink? If discussing and distinguishing from the temperature range, material hardness, insulation performance, thermal conductivity, bonding performance, etc., the specific distinction is as stated below.

Performance and characteristics of thermal conductive silicone sheet
The temperature resistance range of the thermal conductive silicone sheet: The high temperature working range of the high thermal conductivity silicone sheet is 200℃, but the ceramic heat sink can be used normally in high temperature environment above 1700℃.
Material hardness of thermal conductive silicone sheet: Thermally conductive silicone sheet is an elastic silicone material with good compressibility, while ceramic heat sink is a high-hard ceramic material. In terms of hardness, the ceramic heat sink is much higher than the thermal silica gel.

Insulation performance of thermal silica film: The breakdown voltage of the thermally conductive silicone sheet is 4.5KV/mm, while the breakdown voltage of the ceramic heat sink is 15KV/mm, and the volume resistance of the ceramic heat sink is as high as 1012Ω•m.

Characteristics of ceramic heat sink
Ceramic heat sink performance and characteristics
Thermal conductivity of ceramic heat sink: The thermal conductivity of thermally conductive silica gel is far inferior to thermally conductive ceramics doped with a large amount of alumina and aluminum nitride. The thermal conductivity of alumina ceramic heat sink is more than 5 times that of high thermal conductivity silica gel.

Fitting performance of ceramic heat sink: The good insulation and soft belt performance of the thermal conductive silicone sheet make it extremely superior in adhesion performance, and it also makes it extremely widely used in heat conduction and heat dissipation on the chips of various electronic products. However, the heat transfer of the thermally conductive ceramic sheet requires a certain amount of thermally conductive silicone grease to increase its conformability. This is also one of the main reasons why thermally conductive ceramic sheets are not used in a wide range of thermal and heat dissipation of electronic products.

 Even though ceramic heat sinks have many advantages, they cannot completely replace thermally conductive silicone sheets, just as thermally conductive silicone sheets cannot completely replace thermally conductive silicone grease, because each thermally conductive material has its own characteristics and adaptable electronic heat conduction and heat dissipation purposes . Just like the thermal conductive silicone grease for desktop computer chips, the thermal conductive potting glue for outdoor lighting fixtures, and the heat dissipation graphite sheet in smart phones.