The basic heat dissipation method on the notebook: the heat pipe is used to guide the heat to the heat sink on the edge of the machine, and the radiating fan is used to cool the heat sink.
Cooling technology of notebook computer
1. Heat sink
Three major parts of heat dissipation: fan + heat pipe + heat sink
This is a basic heat dissipation method. Generally speaking, the larger the area of the heat sink, the higher the conduction efficiency, and the more effective the heat can be dissipated. A more common situation is to equip a metal heat sink at the bottom and upper part of the motherboard; At the location of the CPU, there is a system that assists in heat dissipation to release the heat generated by the CPU. In addition, a very common technology used in combination with the heat sink is to place a thin heat-dissipating aluminum plate with the same size as the keyboard under the keyboard, and a copper pipe with high thermal conductivity is attached to the aluminum plate. It can evenly spread the heat of the main heating area inside the notebook computer to the entire aluminum plate, and spread the heat to the outside of the computer through the heat dissipation holes.
2. Fan cooling
Radial fan
Fan cooling is also the basic cooling method used by notebook computers, and because of its low cost, most manufacturers use this cooling method. Generally, notebook computers that use cooling fans are equipped with low air volume and high air volume. The speed of the fan depends on the temperature of the CPU. Initially, the notebook CPU relied on a small fan similar to that of a desktop computer for heat dissipation. This method is extremely power consuming and has poor heat dissipation effect. Now, the design is more scientific, and many notebook computer products change the fan from being perpendicular to the motherboard to parallel to the motherboard. The cooling fan parallel to the motherboard is not limited by the thickness of the body. A larger fan is used to improve heat dissipation efficiency, and the design parallel to the motherboard helps to make the body thinner.
3. Cooling holes
ASUS Sonoma notebook battleship W5A bottom cooling map
The heat dissipation hole is an important means of cooling the notebook computer. The general practice is to open a large number of heat dissipation holes around the machine and the feet at the bottom, and the heat in the machine can be dispersed into the surrounding air through these heat dissipation holes. In conjunction with the heat dissipation method of the heat dissipation hole, some laptops also adopt some special air duct diversion designs, and use the position of the heat dissipation hole and the internal structure layout to form a better air circulation environment to enhance heat dissipation.
4. Keyboard convection heat dissipation
The metal plate under the laptop keyboard is an important way to dissipate heat
The keyboard convection cooling is a very creative method. We know that laptops are very thin. When the keyboard is installed above the motherboard, the bottom of the keyboard can be used to conduct heat generated by the CPU. The heat is discharged through the key hole. When hot air is discharged from the key hole, cold air flows in from the key hole to replace the hot air. It can be seen that the keyboard convection heat dissipation not only makes full use of the existing resources and environment, but also is quite effective. Maybe you haven't thought that even the keyboard is a window for heat dissipation. When you are typing on the keyboard, the exchange of hot and cold air is completed with your one click...
5. Heat pipe technology
Three thermally conductive copper pipes provide heat dissipation for mP4 3.2GHz CPU
Heat pipe technology is a very effective heat dissipation technology proposed by IBM. This technique is often applied when some "enthusiasts" overclock the CPU. The heat pipe is a new type of heat dissipation device. There are fibers and water inside. After exhausting the air in the tube, one end is close to the CPU, and the other end is far away from the CPU. Its working principle is: under vacuum, the boiling point of water is very low. If you heat it at one end of the pipe, the water will evaporate, heat the heat to the other end, and then the water will flow back after cooling. Repeatedly, the heat will continue to move, similar to the working principle of an air conditioner. The advantage of the heat pipe is that there are no moving parts, all parts are completely sealed inside, no need to consume batteries, and it can be effective for a long time.
6. Heat dissipation technology of cold and hot plates
Cold plate heat dissipation technology
In addition to IBM's heat pipe technology, Toshiba's notebook computer's cold and hot plate heat dissipation technology is more distinctive. Toshiba is in a leading position in motherboard heat dissipation, and later invented a new method: the cold plate method, which greatly improves the heat dissipation efficiency and resolves the heat dissipation problem of notebook computers.
7. Intelligent temperature control system
This is an essential means of heat dissipation. When the system temperature of the notebook computer reaches a certain temperature, the fan will automatically turn on;
When the system temperature continues to rise, the operating frequency of the CPU will drop to 1/N of the rated frequency;
If the system temperature drops back to a certain temperature, the operating frequency of the CPU will return to the rated operating frequency;
If the system temperature continues to drop to a safe range, the fan will automatically shut down. This intelligent temperature control system can not only effectively help the notebook computer to dissipate heat, but also provide the CPU with the ability to protect itself, making the entire system more reliable and longer life, while also saving machine power and effectively reducing noise . A large number of manufacturers such as Lenovo, Acer and BOE have adopted this technology.
8. Magnesium aluminum alloy shell
Magnesium aluminum alloy shell
The use of magnesium-aluminum alloy casing technology with good thermal conductivity can also be an effective supplement to solve the heat dissipation problem of notebook computers. The thermal conductivity of the magnesium-aluminum alloy shell is far better than that of aluminum metal and engineering plastics, which greatly reduces the number of cooling fans and cooling windows, reduces volume and weight, and reduces power consumption and cost. Most manufacturers' mid- to high-end products now use this technology.
9. Metal frame
In fact, the use of metal as a shell has a certain effect on the heat dissipation of the notebook computer, but the real main force for heat dissipation comes from the metal frame inside the host. Take Inspur Feiyang notebook computer as an example, it uses a new type of "magnesium-aluminum alloy frame inside the machine." This ultra-lightweight, high-rigidity alloy frame has high thermal conductivity. It can dissipate heat naturally under normal system operation and standby state, eliminating the power loss and noise caused by fan operation, and further improving the stability of the system. Since the internal structure of the notebook computer is closer to the heat source of the host, the use of a new type of high thermal conductivity metal material for the structure of the notebook computer can be regarded as a true "inside-out" heat dissipation.
